08053C100FAT4A_技术文档

AVX

Multilayer Ceramic

Chip Capacitor

Ceramic Chip Capacitors

Table of Contents

Basic Capacitor Formulas. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

How to Order - AVX Part Number Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

C0G (NP0) Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Typical Characteristic Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 - 7

X7R Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Typical Characteristic Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - 11

Z5U Dielectric

General Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Typical Characteristic Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 15

Y5V Dielectric

General Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Typical Characteristic Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Low Profile Chips for Z5U & Y5V Dielectric . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

High Voltage Chips for 500V to 5000V Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 - 21

General Specifications

Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 - 23

Mechanical. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

MIL-PRF-55681/Chips

Part Number Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Military Part Number Identification (CDR01 thru CDR06). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Military Part Number Identification (CDR31 thru CDR35). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Military Part Number Identification (CDR31) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Military Part Number Identification (CDR33/34/35). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

European Version CECC 32 101-801 Chips. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Embossed Carrier Configuration - 8 & 12mm Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Paper Carrier Configuration - 8 & 12mm Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Bulk Case Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

MLC Chip Capacitors General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 - 40

Surface Mounting Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 - 43

1

Basic Capacitor Formulas

I. Capacitance (farads)

XI. Equivalent Series Resistance (ohms)

.224 K A

E.S.R. = (D.F.) (Xc) = (D.F.) / (2 π fC)

English: C =

T_D

XII. Power Loss (watts)

.0884 K A

2

Metric: C =

Power Loss = (2 π fCV ) (D.F.)

T_D

XIII. KVA (Kilowatts)

II. Energy stored in capacitors (Joules, watt - sec)

-3

2

KVA = 2 π fCV x 10

2

1

E = ⁄

2

CV

XIV. Temperature Characteristic (ppm/°C)

III. Linear charge of a capacitor (Amperes)

6

Ct – C₂₅

C₂₅(T_t– 25)

dV

dt

T.C. =

x 10

I = C

XV. Cap Drift (%)

IV. Total Impedance of a capacitor (ohms)

C₁– C₂

C₁

2

ͱ

C.D. =

x 100

Z = R_S+ (X - X )

C

L

V. Capacitive Reactance (ohms)

XVI. Reliability of Ceramic Capacitors

1

x =

c

L₀

L_t

V_t

V_o

X

T_t

T_o

Y

=

2 π fC

( ) ( )

VI. Inductive Reactance (ohms)

XVII. Capacitors in Series (current the same)

x_L= 2 π fL

Any Number:

1

C

1

C₂

1

---

=

+

VII. Phase Angles:

C₁

C

N

T

Ideal Capacitors: Current leads voltage 90°

Ideal Inductors: Current lags voltage 90°

Ideal Resistors: Current in phase with voltage

C₁C₂

C₁+ C₂

Two: C =

T

XVIII. Capacitors in Parallel (voltage the same)

VIII. Dissipation Factor (%)

C = C₁+ C₂--- + C

T

N

E.S.R.

D.F.= tan ␦ (loss angle) =

= (2 πfC) (E.S.R.)

X

XIX. Aging Rate

c

IX. Power Factor (%)

^{A.R. = %}D ^{C/decade of time}

P.F. = Sine ␦ (loss angle) = Cos (phase angle)

P.F. = (when less than 10%) = DF

f

XX. Decibels

db = 20 log

V₁

V₂

X. Quality Factor (dimensionless)

1

D.F.

Q = Cotan ␦ (loss angle) =

METRIC PREFIXES SYMBOLS

-12

K

A

T_D

V

t

= Dielectric Constant

= Area

f

= frequency

= Inductance

= Loss angle

= Phase angle

L_t

= Test life

Pico

Nano

Micro

Milli

Deci

Deca

Kilo

Mega

Giga

Tera

X 10

-9

L

␦

V_t

V_o

T_t

= Test voltage

-6

-3

= Dielectric thickness

= Voltage

= Operating voltage

= Test temperature

= Operating temperature

-1

+1

+3

+6

+9

+12

f

= time

X & Y = exponent effect of voltage and temp.

T_o

R

= Series Resistance

L_o

= Operating life

s

2

How to Order

Part Number Explanation

EXAMPLE: 08055A101JAT2A

0805

5

A

101

J

A

T

2

A

Size

(L" x W")

0402

0504

0603

0805

1005

0907

1206

1210

1505

1805

1808

1812

1825

2225

3640

Dielectric

C0G (NP0) = A

X7R = C

Capacitance

Tolerance

C = .25 pFꢀ

D = .50 pFꢀ

F = 1% (≥ 25 pF)

G = 2% (≥ 13 pF)

J = 5%

K = 10%

M = 20%

Z = +80%, -20%

P = +100%, -0%

Terminations

Special**

Code

Standard:

T = Ni and Tin

Plated

A = Standard

Product

X5R = D

Z5U = E

Y5V = G

Non-Standard

P = Embossed

unmarked

M = Embossed

marked

E = Standard

packaging

Others:

7 = Plated Ni

Gold Plated

1 = Pd/Ag

marked

Low Profile

Chips Only

Max. Thickness

T = .66mm (.026")

S = .56mm (.022")

R = .46mm (.018")

Voltage

10V = Z

Capacitance

Code

Failure

Rate

A = Not

Applicable

16V = Y

(2 significant

digits + no. of

zeros)

25V = 3

50V = 5

100V = 1

200V = 2

250V = V

500V = 7

600V = C

1000V = A

1500V = S

2000V = G

2500V = W

3000V = H

4000V = J

5000V = K

Examples:

Packaging**

10 pF = 100

100 pF = 101

1,000 pF = 102

Recommended:

2 =7" Reel

4 =13" Reel

22,000 pF = 223

220,000 pF = 224

1 µF = 105

Others:

7 = Bulk Cassette

9 = Bulk

For values below 10 pF,

use “R” in place of

decimal point, e.g., 9.1

pfd = 9R1.

ꢀC&D tolerances for Յ10 pF values.

ꢀꢀ Standard Tape and Reel material depends upon chip size and thickness.

See individual part tables for tape material type for each capacitance value.

Note: Unmarked product is standard. Marked product is available on special request, please contact AVX.

Standard packaging is shown in the individual tables.

Non-standard packaging is available on special request, please contact AVX.

3

C0G (NP0) Dielectric

General Specifications

C0G (NP0) is the most popular formulation of the “tempera-

ture-compensating,” EIA Class I ceramic materials. Modern

C0G (NP0) formulations contain neodymium, samarium and

other rare earth oxides.

C0G (NP0) ceramics offer one of the most stable capacitor

dielectrics available. Capacitance change with temperature

is 0 30ppm/°C which is less than 0.3% ∆ C from -55°C

to +125°C. Capacitance drift or hysteresis for C0G (NP0)

ceramics is negligible at less than 0.05% versus up to

2% for films. Typical capacitance change with life is less

than 0.1% for C0G (NP0), one-fifth that shown by most

other dielectrics. C0G (NP0) formulations show no aging

characteristics.

The C0G (NP0) formulation usually has a “Q” in excess

of 1000 and shows little capacitance or “Q” changes with

frequency. Their dielectric absorption is typically less than

0.6% which is similar to mica and most films.

PART NUMBER (see page 3 for complete part number explanation)

0805

5

A

101

J

A

T

2

A

Size

(L" x W")

Voltage

25V = 3

50V = 5

100V = 1

200V = 2

Dielectric

C0G (NP0) = A

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Solder

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std.

Product

Code

Tolerance

Preferred

K = 10%

J = 5%

PERFORMANCE CHARACTERISTICS

Capacitance Range

0.5 pF to .1 µF (1.0 0.2 Vrms, 1kHz, for ≤100 pF use 1 MHz)

Capacitance Tolerances

Preferred 5%, 10%

others available: .25 pF, .5 pF, 1% (≥25pF), 2%(≥13pF), 20%

For values ≤ 10 pF preferred tolerance is .5 pF, also available .25 pF.

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

-55°C to +125°C

0

30 ppm/°C (EIA C0G)

25, 50, 100 & 200 VDC (+125°C)

Dissipation Factor and “Q”

For values >30 pF: 0.1% max. (+25°C and +125°C)

For values ≤30 pF: “Q” = 400 + 20 x C (C in pF)

Insulation Resistance (+25°C, RVDC)

Insulation Resistance (+125°C, RVDC)

Dielectric Strength

100,000 megohms min. or 1000 MΩ - µF min., whichever is less

10,000 megohms min. or 100 MΩ - µF min., whichever is less

250% of rated voltage for 5 seconds at 50 mamp max. current

Test Voltage

1

0.2 Vrms

Test Frequency

For values ≤100 pF: 1 MHz

For values >100 pF: 1 KHz

4

C0G (NP0) Dielectric

Typical Characteristic Curves**

Variation of Impedance with Cap Value

Impedance vs. Frequency

0805 - C0G (NP0)

Temperature Coefficient

10 pF vs. 100 pF vs. 1000 pF

Typical Capacitance Change

Envelope: 0 30 ppm/°C

100,000

10,000

1,000

100

+0.5

0

-0.5

10 pF

10.0

-55 -35

+125

-15 +5 +25 +45 +65 +85 +105

1.0

0.1

100 pF

1000 pF

Temperature °C

1

100

1000

10

⌬ Capacitance vs. Frequency

Frequency, MHz

Variation of Impedance with Chip Size

Impedance vs. Frequency

1000 pF - C0G (NP0)

+2

+1

10

0

-1

-2

1206

0805

1812

1210

1.0

0.1

1KHz

10 KHz

100 KHz

1 MHz

10 MHz

Frequency

100

1000

10

Frequency, MHz

Insulation Resistance vs Temperature

10,000

1,000

100

Variation of Impedance with Ceramic Formulation

Impedance vs. Frequency

1000 pF - C0G (NP0) vs X7R

0805

10.00

X7R

NPO

1.00

0.10

0.01

0

+20

+40

+60

+80 +100

+25

Temperature °C

100

1000

10

Frequency, MHz

SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE

Style

0402*

0504

25V

0.5pF - 220pF

0.5pF - 330pF

0.5pF - 1nF

0.5pF - 4.7nF

0.5pF - 10nF

560pF - 10nF

—

50V

100V

200V

0.5pF - 120pF

0.5pF - 150pF

0.5pF - 1nF

0.5pF - 2.2nF

0.5pF - 4.7nF

560pF - 10nF

10pF - 1.5nF

1nF - 4.7nF

1nF - 10nF

—

0.5pF - 68pF

0.5pF - 330pF

0.5pF - 1nF

0.5pF - 2.2nF

560pF - 3.9nF

10pF - 820pF

1nF - 3.9nF

1nF - 4.7nF

1nF - 12nF

—

0603*

0805*

1206*

1210*

1505

—

0.5pF - 470pF

0.5pF - 1nF

560pF - 1.5nF

10pF - 560pF

1nF - 2.2nF

1nF - 3.3nF

1nF - 6.8nF

3.3nF - 27nF

1nF - 39nF

1808

→

1812*

1825*

2220

1nF - 15nF

→

1nF - 22nF

→

4.7nF - 47nF

1nF - 100nF

4.7nF - 39nF

1nF - 39nF

2225

→

ꢀ Standard Sizes

ꢀꢀ For additional information on performance changes with operating conditions consult AVX’s software SpiCap.

5

C0G (NP0) Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0402*

0504*

0603*

0805

1206

1505

Standard Reel

All Paper

1.00 .10

(.040 .004)

.50 .10

(.020 .004)

All Embossed

1.27 .25

(.050 .010)

1.02 .25

(.040 .010)

All Paper

1.60 .15

(.063 .006)

.81 .15

(.032 .006)

Paper/Embossed

2.01 .20

(.079 .008)

1.25 .20

(.049 .008)

Paper/Embossed

3.20 .20

(.126 .008)

1.60 .20

(.063 .008)

All Embossed

3.81 .25

(.150 .010)

1.27 .25

(.050 .010)

Packaging

MM

(L) Length

(W) Width

(in.)

MM

(in.)

MM

(in.)

MM

(in.)

.60

1.02

.90

1.30

1.50

1.27

(T) Max. Thickness

(t) Terminal

WVDC

(.024)

(.040)

(.035)

(.051)

(.059)

(.050)

.25 .15

(.010 .006)

.38 .13

(.015 .005)

.35 .15

(.014 .006)

.50 .25

(.020 .010)

.50 .25

(.020 .010)

.50 .25

(.020 .010)

25

50

25

50

100

25

50

100

25

50

100

200

25

50

100

200

50

100

200

Cap

(pF)

0.5

W

1.0

1.2

1.5

L

᭢

T

᭢

1.8

2.2

2.7

t

3.3

3.9

4.7

5.6

6.8

8.2

10

12

15

18

22

27

33

39

47

56

68

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

10000

= Paper Tape

= Embossed Tape

*Reflow soldering only.

NOTES: For higher voltage chips, see pages 20 and 21.

6

C0G (NP0) Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

1210

1808*

1812*

1825*

2220*

2225*

Standard Reel Packaging

Paper/Embossed

All Embossed

MM

(in.)

3.20 .20

(.126 .008)

4.57 .25

(.180 .010)

4.50 .30

(.177 .012)

4.50 .30

(.177 .012)

5.7 .40

(.225 .016)

5.72 .25

(.225 .010)

(L) Length

MM

(in.)

2.50 .20

(.098 .008)

2.03 .25

(.080 .010)

3.20 .20

(.126 .008)

6.40 .40

(.252 .016)

5.0 .40

(.197 .016)

6.35 .25

(.250 .010)

(W) Width

MM

(in.)

1.70

(.067)

1.52

(.060)

1.70

(.067)

1.70

(.067)

2.30

(.090)

1.70

(.067)

(T) Max. Thickness

(t) Terminal

MM

(in.)

.50 .25

(.020 .010)

.64 .39

(.025 .015)

.61 .36

(.024 .014)

.61 .36

(.024 .014)

.64 .39

(.025 .015)

.64 .39

(.025 .015)

WVDC

25

50

100

200

50

100

200

25

50

100

200

50

100

200

50

100

200

50

100

200

Cap

(pF)

560

680

820

W

L

᭢

1000

1200

1500

T

᭢

1800

2200

2700

t

3300

3900

4700

5600

6800

8200

Cap.

(µF)

.010

.012

.015

.018

.022

.027

.033

.039

.047

.068

.082

.1

= Paper Tape

*Reflow soldering only.

= Embossed Tape

NOTES: For higher voltage chips, see pages 20 and 21.

7

X7R Dielectric

General Specifications

X7R formulations are called “temperature stable” ceramics

and fall into EIA Class II materials. X7R is the most popular

of these intermediate dielectric constant materials. Its tem-

perature variation of capacitance is within 15% from

-55°C to +125°C. This capacitance change is non-linear.

Capacitance for X7R varies under the influence of electrical

operating conditions such as voltage and frequency.

X7R dielectric chip usage covers the broad spectrum of

industrial applications where known changes in capaci-

tance due to applied voltages are acceptable.

PART NUMBER (see page 3 for complete part number explanation)

0805

5

C

103

M

A

T

2

A

Size

(L" x W")

Voltage

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

Dielectric

X7R = C

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Solder

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std.

Product

Code

Tolerance

Preferred

M = 20%

K = 10%

PERFORMANCE CHARACTERISTICS

Capacitance Range

100 pF to 2.2 µF (1.0 0.2 Vrms, 1kHz)

Capacitance Tolerances

Preferred 10%, 20%

others available: 5%, +80 –20%

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

-55°C to +125°C

15% (0 VDC)

10, 16, 25, 50, 100 VDC (+125°C)

Dissipation Factor

For 50 volts and 100 volts: 2.5% max.

For 25 volts: 3.0% max.

For 16 volts: 3.5% max.

For 10 volts: 5% max.

Insulation Resistance (+25°C, RVDC)

Insulation Resistance (+125°C, RVDC)

Dielectric Strength

100,000 megohms min. or 1000 MΩ - µF min., whichever is less

10,000 megohms min. or 100 MΩ - µF min., whichever is less

250% of rated voltage for 5 seconds at 50 mamp max. current

1.0 0.2 Vrms

Test Voltage

Test Frequency

1 KHz

8

X7R Dielectric

Typical Characteristic Curves**

Variation of Impedance with Cap Value

Impedance vs. Frequency

1,000 pF vs. 10,000 pF - X7R

0805

Temperature Coefficient

+12

+6

0

10.00

1,000 pF

10,000 pF

-6

1.00

-12

-18

-24

0.10

0.01

-75 -50

+125

+25 +50 +75 +100

-25

0

Temperature °C

100

1000

10

Frequency, MHz

Variation of Impedance with Chip Size

Impedance vs. Frequency

10,000 pF - X7R

⌬ Capacitance vs. Frequency

10

1206

0805

1210

+20

+10

1.0

0

-10

-20

0.1

.01

100

1,000

1

10

1KHz

10 KHz

100 KHz

1 MHz

10 MHz

Frequency, MHz

Frequency

Variation of Impedance with Chip Size

Impedance vs. Frequency

100,000 pF - X7R

Insulation Resistance vs Temperature

10,000

1,000

100

10

1206

0805

1210

1.0

0.1

.01

0

+20

+40

+60

+80 +100

+25

100

1,000

1

10

Temperature °C

Frequency, MHz

SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE

Style

0402*

0504

10V

16V

25V

50V

100V

—

100pF - 47nF

100pF - 6.8nF

100pF - 3.9nF

100pF - .01µF

100pF - 15nF

100pF - 0.1µF

1nF - 0.22µF

1nF - 0.1µF

10nF - 0.33µF

10nF - 1µF

—

100pF - 3.3nF

100pF - 4.7nF

100pF - 22nF

1nF - 0.1µF

1nF - 27nF

0603*

0805*

1206*

1210*

1505

100pF - 0.22µF

100pF - 0.1µF

100pF - 47nF

100pF - 2.2µF

100pF - 0.47µF

100pF - 0.22µF

1.5µF - 4.7µF

1nF - 1µF

1nF - 1.0µF

→

1nF - 1.8µF

1nF - 1µF

→

1808

10nF - 0.33µF

10nF - 0.1µF

10nF - 0.47µF

10nF - 1.2µF

10nF - 1.5µF

1812*

1825*

2220

→

10nF - 1µF

10nF - 1.5µF

10nF - 2.2µF

2225

ꢀ Standard Sizes

ꢀꢀ For additional information on performance changes with operating conditions consult AVX’s software SpiCap.

9

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0402*

0504*

0603*

0805

1206

1505

Standard Reel

Packaging

All Paper

All Embossed

All Paper

Paper/Embossed

All Embossed

MM

(in.)

1.00 .10

(.040 .004)

1.27 .25

(.050 .010)

1.60 .15

(.063 .006)

2.01 .20

(.079 .008)

3.20 .20

(.126 .008)

3.81 .25

(.150 .010)

(L) Length

MM

(in.)

.50 .10

(.020 .004)

1.02 .25

(.040 .010)

.81 .15

(.032 .006)

1.25 .20

(.049 .008)

1.60 .20

(.063 .008)

1.27 .25

(.050 .010)

(W) Width

MM

(in.)

.60

(.024)

1.02

(.040)

.90

(.035)

1.30

(.051)

1.50

(.059)

1.27

(.050)

(T) Max. Thickness

MM

(in.)

.25 .15

.38 .13

.35 .15

.50 .25

(t) Terminal

WVDC

(.010 .006)

(.015 .005)

(.014 .006)

(.020 .010)

16

25

50

100

10

16

25

50 100 10

16

25

50 100

10

16

25

50 100

50

100

Cap

(pF)

100

120

150

W

L

᭢

T

180

220

270

᭢

330

390

470

t

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

Cap.

(µF)

.010

.012

.015

.018

.022

.027

.033

.039

.047

.056

.068

.082

.10

.12

.15

.18

.22

.27

.33

.47

.56

.68

.82

1.0

1.2

1.5

1.8

2.2

4.7

= Paper Tape

= Embossed Tape

*Reflow soldering only.

NOTES: For higher voltage chips, see pages 20 and 21.

10

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

1210

1808*

1812*

1825*

2220*

2225*

Standard Reel Packaging

Paper/Embossed

All Embossed

MM

(in.)

3.20 .20

(.126 .008)

4.57 .25

(.180 .010)

4.50 .30

(.177 .012)

4.50 .30

(.177 .012)

5.7 0.4

(.225 .016)

5.72 .25

(.225 .010)

(L) Length

MM

(in.)

2.50 .20

(.098 .008)

2.03 .25

(.080 .010)

3.20 .20

(.126 .008)

6.40 .40

(.252 .016)

5.0 0.4

(.197 .016)

6.35 .25

(.250 .010)

(W) Width

MM

(in.)

MM

(in.)

1.70

1.52

1.70

2.30

1.70

(T) Max. Thickness

(t) Terminal

(.067)

(.060)

(.067)

(.090)

(.067)

.50 .25

(.020 .010)

.64 .39

(.025 .015)

.61 .36

(.024 .014)

.61 .36

(.024 .014)

.64 .39

(.025 .015)

.64 .39

(.025 .015)

WVDC

16

25

50

100

25

50

100

50

100

50

100

50

100

200

50

100

Cap

(pF)

1000

1200

1500

W

L

᭢

1800

2200

2700

T

᭢

3300

3900

4700

t

5600

6800

8200

Cap.

(µF)

.010

.012

.015

.018

.022

.027

.033

.039

.047

.056

.068

.082

.10

.12

.15

.18

.22

.27

.33

.39

.47

.56

.68

.82

1.0

1.2

1.5

1.8

2.2

*Reflow soldering only.

= Paper Tape

= Embossed Tape

NOTES: For higher voltage chips, see pages 20 and 21.

11

Z5U Dielectric

General Specifications

Z5U formulations are “general-purpose” ceramics which are

meant primarily for use in limited temperature applications

where small size and cost are important. Z5U show wide

variations in capacitance under influence of environmental

and electrical operating conditions.

Despite their capacitance instability, Z5U formulations

are very popular because of their small size, low ESL, low

ESR and excellent frequency response. These features are

particularly important for decoupling application where only a

minimum capacitance value is required.

PART NUMBER (see page 3 for complete part number explanation)

0805

5

E

104

Z

A

T

2

A

Size

(L" x W")

Voltage

25V = 3

50V = 5

Dielectric

Z5U = E

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Solder

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std.

Product

Code

Tolerance

Preferred

Z = +80%

–20%

M = 20%

PERFORMANCE CHARACTERISTICS

Capacitance Range

0.01 µF to 1.0 µF

Capacitance Tolerances

Preferred +80 –20%

others available: 20%, +100 –0%

+10°C to +85°C

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

+22% to –56% max.

25 and 50VDC (+85°C)

4% max.

Dissipation Factor

Insulation Resistance (+25°C, RVDC)

Dielectric Strength

10,000 megohms min. or 1000 MΩ - µF min., whichever is less

250% of rated voltage for 5 seconds at 50 mamp max. current

Test Voltage

0.5 0.2 Vrms

1 KHz

Test Frequency

12

Z5U Dielectric

Typical Characteristic Curves**

Temperature Coefficient

Variation of Impedance with Cap Value

Impedance vs. Frequency

1206 -Z5U

+30

+20

+10

0

100.00

-10

-20

-30

-40

-50

-60

10.00

1.00

10,000 pF

+10 +25

+45

+50 +55 +65 +85

+30 +35 +40

100,000 pF

Temperature °C

0.10

0.01

100

1,000

1

10

Frequency, MHz

Variation of Impedance with Chip Size

Impedance vs. Frequency

.33 ␮F - Z5U

⌬ Capacitance vs. Frequency

1000

100

10

0

-10

-20

-30

-40

Z5U 1206

Z5U 1210

Z5U 1812

1

1KHz

10 KHz

100 KHz

1 MHz

10 MHz

0.1

0.001

Frequency

100

1,000

0.01

0.1

1

10

Frequency, MHz

Variation of Impedance with Ceramic Formulation

Impedance vs. Frequency

nsu ation Resistance vs Temperature

100,000

10,000

.1␮F X7R vs. Z5U

0805

10000

X7R 0805

Z5U 0805

1000

1,000

100

0

100

10

1

0.1

+20

+40

+50 +60

+70

+80

+30

Temperature °C

0.01

0.001

100

1,000

0.01

0.1

1

10

Frequency, MHz

SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE

Style

0603*

0805*

1206*

1210*

1808

25V

50V

.01µF - .047µF

.01µF - .12µF

.01µF - .33µF

.01µF - .56µF

.01µF - 1.0µF

.01µF - .027µF

.01µF - 0.1µF

.01µF - .33µF

.01µF - .47µF

.01µF - 1.0µF

1812*

1825*

2225

ꢀ Standard Sizes

ꢀꢀ For additional information on performance changes with operating conditions consult AVX’s software SpiCap.

13

Z5U Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0603*

0805

1206

1210

Standard Reel Packaging

All Paper

Paper/Embossed

MM

(in.)

1.60 .15

(.063 .006)

2.01 .20

(.079 .008)

3.20 .20

(.126 .008)

3.20 .20

(.126 .008)

(L) Length

MM

(in.)

.81 .15

(.032 .006)

1.25 .20

(.049 .008)

1.60 .20

(.063 .008)

2.50 .20

(.098 .008)

(W) Width

MM

(in.)

.90

(.035)

1.30

(.051)

1.50

(.059)

1.70

(.067)

(T) Max. Thickness

MM

(in.)

.35 .15

.50 .25

(t) Terminal

WVDC

(.014 .006)

(.020 .010)

25

50

25

50

25

50

25

50

Cap

(µF)

.010

.012

W

L

᭢

.015

.018

.022

T

᭢

.027

.033

.039

t

.047

.056

.068

.082

.10

.12

.15

.18

.22

.27

.33

.39

.47

.56

.68

.82

1.0

1.5

= Paper Tape

= Embossed Tape

*Reflow soldering only.

NOTES: For low profile chips, see page 19.

14

Z5U Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

1808*

1812*

1825*

2225*

Standard Reel Packaging

All Embossed

MM

(in.)

04.57 .25

(.180 .010)

4.50 .30

(.177 .012)

4.50 .30

(.177 .012)

5.72 .25

(.225 .010)

L) Length

(

MM

(in.)

2.03 .25

(.080 .010)

3.20 .20

(.126 .008)

6.40 .40

(.252 .016)

6.35 .25

(.250 .010)

(W) Width

MM

(in.)

1.52

(.060)

1.70

(.067)

1.70

(.067)

1.70

(.067)

(T) Max. Thickness

MM

(in.)

.64 .39

.61 .36

.64 .39

(t) Terminal

WVDC

(.025 .015)

(.024 .014)

(.025 .015)

25

50

25

50

25

50

25

50

Cap

(µF)

.010

.012

.015

.018

.022

W

L

᭢

T

᭢

.027

.033

.039

t

.047

.056

.068

.082

.10

.12

.15

.18

.22

.27

.33

.39

.47

.56

.68

.82

1.0

1.5

= Paper Tape

= Embossed Tape

*Reflow soldering only.

NOTES: For low profile chips, see page 19.

15

Y5V Dielectric

General Specifications

Y5V formulations are for general-purpose use in a limited

temperature range. They have a wide temperature character-

istic of +22% –82% capacitance change over the operating

temperature range of –30°C to +85°C.

Y5V’s high dielectric constant allows the manufacture of the

highest capacitance value in a given case size.

These characteristics make Y5V ideal for decoupling applica-

tions within limited temperature range.

PART NUMBER (see page 3 for complete part number explanation)

0805

3

G

104

Z

A

T

2

A

Size

(L" x W")

Voltage

10V = Z

16V = Y

25V = 3

50V = 5

Dielectric

Y5V = G

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Solder

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std.

Product

Code

Tolerance

Z = +80 –20%

PERFORMANCE CHARACTERISTICS

Capacitance Range

2200 pF to 22 µF

+80 –20%

Capacitance Tolerances

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

–30°C to +85°C

+22% to –82% max. within operating temperature

10, 16, 25 and 50 VDC (+85°C)

Dissipation Factor

For 50 volts: 5.0% max.

For 16 and 25 volts: 7% max.

For 10 volts: 10% max.

Insulation Resistance (+25°C, RVDC)

Dielectric Strength

Test Voltage

10,000 megohms min. or 1000 MΩ - µF min., whichever is less

250% of rated voltage for 5 seconds at 50 mamp max. current

1.0 Vrms 0.2 Vrms

1 KHz

Test Frequency

16

Y5V Dielectric

Typical Characteristic Curves**

0.1 ␮F - 0603

Impedance vs. Frequency

Temperature Coefficient

10,000

1,000

+20

+10

0

-10

100

10

1

-20

-30

-40

-50

-60

-70

-80

0.1

0.01

10,000

-55 -35

+125

100,000

10,000,000

-15 +5 +25 +45 +65 +85 +105

1,000,000

Frequency (Hz)

Temperature °C

0.22 ␮F - 0805

Impedance vs. Frequency

Capacitance Change

vs. DC Bias Voltage

1,000

100

10

+40

+20

0

-20

-40

-60

-80

-100

1

0.1

0.01

10,000

100,000

1,000,000

10,000,000

0

20

40

60

100

80

Frequency (Hz)

DC Bias Voltage

Insulation Resistance vs. Temperature

1 ␮F - 1206

Impedance vs. Frequency

10,000

1,000

100

1,000

100

10

1

0.1

0

0.01

10,000

+20

+30

+40 +50

+60 +70 +80 +85

100,000

1,000,000

10,000,000

Temperature °C

Frequency (Hz)

SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE

Style

0402*

0603*

0805*

1206*

1210*

1812*

1825*

2220

10V

2.2nF - 0.1µF

2.2nF - 1µF

10nF - 4.7µF

10nF - 10µF

10nF - 22µF

→

16V

2.2nF - 0.1µF

2.2nF - 0.33µF

10nF - 2.2µF

10nF - 4.7µF

0.1µF - 10µF

→

25V

2.2nF - 22nF

50V

2.2nF - 10nF

2.2nF - 56nF

10nF - 0.33µF

10nF - 1µF

2.2nF - 0.22µF

10nF - 1µF

10nF - 2.2µF

0.1µF - 4.7µF

0.15µF - 1.5µF

0.47µF - 1.5µF

—

0.1µF - 1µF

1.5nF - 1.5µF

0.47µF - 1.5µF

1µF - 1.5µF

0.68µF - 1.5µF

→

—

2225

→

0.68µF - 2.2µF

ꢀ Standard Sizes

ꢀꢀ For additional information on performance changes with operating conditions consult AVX’s software SpiCap.

17

Y5V Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0402*

0603*

0805

1206

1210

1812*

1825*

2220*

2225*

Standard Reel

Packaging

All Paper

Paper/Embossed Paper/Embossed Paper/Embossed All Embossed

All Embossed

MM

(in.)

1.00 .10

(.040 .004)

1.60 .15

(.063 .006)

2.01 .20

(.079 .008)

3.20 .20

(.126 .008)

3.20 .20

(.126 .008)

4.50 .30

(.177 .012)

4.50 .30

(.252 .016)

5.7 0.4

(.225 .016)

5.72 .25

(.225 .010)

(L) Length

MM

(in.)

.50 .10

(.020 .004)

.81 .15

(.032 .006)

1.25 .20

(.049 .008)

1.60 .20

(.063 .008)

2.50 .20

(.098 .008)

3.20 .20

(.126 .008)

6.40 .40

(.252 .016)

5.0 0.4

(.197 .016)

6.35 .25

(.250 .010)

(W) Width

MM

(in.)

.60

(.024)

.90

(.035)

1.30

(.051)

1.50

(.059)

1.70

(.067)

1.70

(.067)

1.70

(.067)

2.30

(.090)

1.70

(.067)

(T) Max. Thickness

MM

(in.)

.25 .15

.35 .15

.50 .25

.61 .36

.64 .39

(t) Terminal

WVDC

(.010 .006)

(.014 .006)

(.020 .010)

(.024 .014)

(.025 .015)

16 25 50

25

50

25

50

25

50

10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10

Cap

(pF)

2200

2700

3300

W

L

᭢

T

3900

4700

5600

᭢

6800

8200

t

Cap

(µF)

.01

.012

.015

.018

.022

.027

.033

.039

.047

.056

.068

.082

.10

.12

.15

.18

.22

.27

.33

.39

.47

.56

.68

.82

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10.0

12.0

15.0

18.0

22.0

*Reflow soldering only.

= Paper Tape

= Embossed Tape

NOTES: For low profile product, see page 19.

18

Low Profile Chips

Z5U & Y5V Dielectric

PART NUMBER (see page 3 for complete information and options)

1206

3

E

224

Z

A

T

2

T

Size

(L" x W")

Voltage

25V = 3

Dielectric

Z5U = E

Y5V = G

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Solder

Packaging

2 = 7" Reel

4 = 13" Reel

Thickness

Code

Tolerance

T = .026" Max.

S = .022" Max.

R = .018" Max.

Z = +80/-20%

PERFORMANCE CHARACTERISTICS

Capacitance Range

Z5U: .01 – .33µF;

Y5V: .01 – .47µF

Capacitance Tolerances

+80, -20%

Operating Temperature Range

Z5U: +10°C to +85°C;

Y5V: -30°C to +85°C

Temperature Characteristic

Z5U: +22%, -56%;

Y5V: +22%, -82%

Voltage Ratings

25 VDC

Dissipation Factor 25°C, .5 Vrms, 1kHz

Z5U: 4%;

Y5V: 7%

Insulation Resistance

10,000 megohms min. or 1000 MΩ - µF whichever is less

Dielectric Strength for

5 seconds at 50 mamp max. current

250% of rated VDC

Test Voltage

Z5U: 0.5 0.2 Vrms

Y5V: 1.0 Vrms 0.2 Vrms

Test Frequency

1 KHz

CAPACITANCE VALUES FOR VARIOUS THICKNESSES

Z5U

Y5V

SIZE

0805

1206

1210

SIZE

0805

1206

1210

MM

(in.)

2.01 .20

(.079 .008)

3.2 .2

(.126 .008)

3.2 .2

(.126 .008)

MM

(in.)

2.01 .20

(.079 .008)

3.2 .2

(.126 .008)

3.2 .2

(.126 .008)

(L) Length

MM

(in.)

1.25 .20

(.049 .008)

1.6 .2

(.063 .008)

2.5 .2

(.098 .008)

MM

(in.)

1.25 .20

(.049 .008)

1.6 .2

(.063 .008)

2.5 .2

(.098 .008)

(W) Width

MM

(in.)

.50 .25

(.020 .010)

.50 .25

(.020 .010)

.50 .25

(.020 .010)

MM

(in.)

.50 .25

(.020 .010)

.50 .25

(.020 .010)

.50 .25

(.020 .010)

(t) Terminal

(T) Thickness MM

.46

.56

.66

(.026)

.46

(.018)

.56

(.022)

.66

(.026)

.46

(.018)

.56

(.022)

.66

(.026)

(T) Thickness

Max.

MM

(in.) (.018)

.46

.56

(.022)

.66

(.026)

.46

(.018)

.56

(.022)

.66

(.026)

.46

(.018)

.56

.66

Max.

(in.)

(.018) (.022)

(.022) (.026)

Cap

(µF)

.01

.012

.015

Cap

(µF)

.01

.012

.015

.018

.022

.027

.018

.022

.027

.033

.039

.047

.033

.039

.047

.056

.068

.082

.056

.068

.082

.1

.12

.15

.1

.12

.15

.18

.22

.27

.18

.22

.27

.33

.39

.47

.33

.39

.47

= Paper Tape

19

High Voltage Chips

For 500V to 5000V Applications

High value, low leakage and small size are difficult parame-

ters to obtain in capacitors for high voltage systems. AVX

special high voltage MLC chips capacitors meet these per-

formance characteristics and are designed for applications

such as snubbers in high frequency power converters, res-

onators in SMPS, and high voltage coupling/DC blocking.

These high voltage chip designs exhibit low ESRs at high

frequencies.

High voltage chips are typically larger than standard volt-

age rated chips. These larger sizes require that special

precautions be taken in applying these chips in surface

mount assemblies. This is due to differences in the coeffi-

cient of thermal expansion (CTE) between the substrate

materials and chip capacitors.

PART NUMBER (see page 3 for complete information and options)

1808

A

271

K

A

1

A

AVX

Style

1206

1210

1808

1812

1825

2225

3640

Voltage

500V = 7

Temperature Capacitance Capacitance

Failure

Rate

Termination

1= Pd/Ag

T= Plated Ni

and Solder

Packaging

1 = 7" Reel

Embossed A = Standard

Tape

3 = 13" Reel

Embossed

Tape

9 = Bulk

Special

Code

Coefficient

C0G = A

X7R = C

Code

Tolerance

C0G: J= 5%

K= 10%

M= 20%

X7R: K= 10%

M= 20%

600V = C

1000V = A

1500V = S

2000V = G

2500V = W

3000V = H

4000V = J

5000V = K

(2 significant digits

+ no. of zeros)

Examples:

10pF = 100

100pF = 101

1,000pF = 102

22,000pF = 223

A=Not

applicable

Z= +80%

- 20%

220,000pF = 224

1µF = 105

20

High Voltage Chips

For 500V to 5000V Applications

C0G (NP0) Dielectric

PERFORMANCE CHARACTERISTICS

Capacitance Range

100 pF to .047 µF

(25°C, 1.0 0.2 Vrms at 1kHz)

Capacitance Tolerances

Dissipation Factor

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

Insulation Resistance (+25°C, at 500 VDC)

Insulation Resistance (+125°C, at 500 VDC)

Dielectric Strength

5%, 10%, 20%

0.1% max. (+25°C, 1.0 0.2 Vrms, 1kHz)

–55°C to +125°C

0 30 ppm/°C (0 VDC)

500, 600, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)

100,000 megohms min. or 1000 MΩ - µF min., whichever is less

10,000 megohms min. or 100 MΩ - µF min., whichever is less

120% rated voltage for 5 seconds at 50 mamp max. current

Dependent upon size, voltage, and capacitance value

Thickness

C0G (NP0) MAXIMUM CAPACITANCE VALUES

VOLTAGE

1206

680 pF

330 pF

120 pF

68 pF

—

1210

1500 pF

680 pF

270 pF

120 pF

—

1808

3300 pF

1500 pF

330 pF

270 pF

100 pF

82 pF

—

1812

5600 pF

2200 pF

560 pF

470 pF

220 pF

180 pF

—

1825

.012 µF

5600 pF

1500 pF

1200 pF

560 pF

270 pF

—

2225

.018 µF

8200 pF

1800 pF

1500 pF

820 pF

680 pF

—

3640

—

500

600

.047 µF

.018 µF

5600 pF

4700 pF

2700 pF

2200 pF

1000 pF

680 pF

1000

1500

2000

2500

3000

4000

5000

—

X7R Dielectric

PERFORMANCE CHARACTERISTICS

Capacitance Range

1000 pF to 0.56 µF (25°C, 1.0 0.2 Vrms at 1kHz)

Capacitance Tolerances

Dissipation Factor

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

Insulation Resistance (+25°C, at 500 VDC)

Insulation Resistance (+125°C, at 500 VDC)

Dielectric Strength

10%, 20%, +80% -20%

2.5% max. (+25°C, 1.0 0.2 Vrms, 1kHz)

–55°C to +125°C

15% (0 VDC)

500, 600, 1000, 1500, 2000, 2500, 3000 & 4000 VDC (+125°C)

100,000 megohms min. or 1000 MΩ - µF min., whichever is less

10,000 megohms min. or 100 MΩ - µF min., whichever is less

120% rated voltage for 5 seconds at 50 mamp max. current

Dependent upon size, voltage, and capacitance value

Thickness

X7R MAXIMUM CAPACITANCE VALUES

VOLTAGE

1206

.015 µF

4700 pF

1200 pF

470 pF

—

1210

.027 µF

8200 pF

2700 pF

820 pF

—

1808

1812

.056 µF

.068 µF

.027 µF

5600 pF

3300 pF

2200 pF

—

1825

—

2225

—

3640

—

500

—

600

.039 µF

.015 µF

2700 pF

1500 pF

1200 pF

—

.15 µF

.068 µF

.012 µF

6800 pF

5600 pF

—

.22 µF

.082 µF

.018 µF

.010 µF

8200 pF

4700 pF

—

.56 µF

.22 µF

.056 µF

.027 µF

.022 µF

.018 µF

5600 pF

1000

1500

2000

2500

3000

4000

—

21

General Specifications

Environmental

MOISTURE RESISTANCE

Specification

THERMAL SHOCK

Specification

Appearance

No visual defects

Appearance

No visual defects

Capacitance Variation

C0G (NP0): 2.5% or .25pF, whichever is greater

X7R: ≤ 7.5%

Capacitance Variation

C0G (NP0): 5% or .5pF, whichever is greater

X7R: ≤ 10%

Z5U: ≤ 20%

Z5U: ≤ 30%

Y5V: ≤ 20%

Y5V: ≤ 30%

Q, Tan Delta

To meet initial requirement

C0G (NP0):≥ 30pF........................Q ≥ 350

≥ 10pF, < 30pF...........Q ≥ 275+5C/2

< 10pF ........................Q ≥ 200+10C

X7R: Initial requirement + .5%

Z5U: Initial requirement + 1%

Y5V: Initial requirement + 2%

Insulation Resistance

C0G (NP0), X7R: To meet initial requirement

Z5U, Y5V: ≥ Initial Value x 0.1

Dielectric Strength

No problem observed

Insulation Resistance

≥ Initial Value x 0.3

Measuring Conditions

Step

Temperature °C

Time (minutes)

Measuring Conditions

C0G (NP0), X7R: -55° 2°

Z5U: +10° 2°

1

30

3

Step

Temp. °C

Humidity % Time (hrs)

Y5V: -30° 2°

1

+25->+65

+65

+65->+25

+25->+65

+65

+65->+25

+25

90-98

2.5

3.0

2.5

3.0

2.5

2.0

–

2

3

Room Temperature

C0G (NP0), X7R: +125° 2°

Z5U, Y5V: +85° 2°

# 3

30

# 3

2

3

80-98

3

4

90-98

4

Room Temperature

5

90-98

6

80-98

Repeat for 5 cycles and measure after 48 hours 4 hours

(24 hours for C0G (NP0)) at room temperature.

7

90-98

7a

7b

-10

+25

uncontrolled

90-98

–

IMMERSION

Specification

Repeat 20 cycles (1-7) and store for 48 hours (24 hours

for C0G (NP0)) at room temperature before measuring.

Steps 7a & 7b are done on any 5 out of first 9 cycles.

Appearance

No visual defects

Capacitance Variation

C0G (NP0): 2.5% or .25pF, whichever is greater

X7R: ≤ 7.5%

Z5U: ≤ 20%

Y5V: ≤ 20%

Q, Tan Delta

To meet initial requirement

Insulation Resistance

C0G (NP0), X7R: To meet initial requirement

Z5U, Y5V: ≥ Initial Value x 0.1

Dielectric Strength

No problem observed

Measuring Conditions

Step

Temperature °C

Time (minutes)

+65 +5/-0

Pure Water

1

15

2

0

3

2

15

2

NaCl solution

Repeat cycle 2 times and wash with water and dry.

Store at room temperature for 48 4 hours (24 hours for

C0G (NP0)) and measure.

22

General Specifications

Environmental

STEADY STATE HUMIDITY

(No Load)

Insulation Resistance

C0G (NP0), X7R: To meet initial value x 0.3

Z5U, Y5V: ≥ Initial Value x 0.1

Specification

Charge devices with rated voltage in test chamber set

Appearance

at 85

5% relative humidity and 85°C for 1000

No visual defects

(+48,-0) hours. Remove from test chamber and

Capacitance Variation

C0G (NP0): 5% or .5pF, whichever is greater

X7R: ≤ 10%

stabilize at room temperature and humidity for 48

hours (24 2 hours for C0G (NP0)) before measuring.

4

Charge and discharge currents must be less than

50ma.

Z5U: ≤ 30%

Y5V: ≤ 30%

Q, Tan Delta

C0G (NP0): ≥ 30pF......................Q ≥ 350

≥ 10pF, < 30pF.........Q ≥ 275+5C/2

< 10pF ....................Q ≥ 200+10C

X7R: Initial requirement + .5%

Z5U: Initial requirement + 1%

Y5V: Initial requirement + 2%

LOAD LIFE

Specification

Appearance

No visual defects

Insulation Resistance

≥ Initial Value x 0.3

Measuring Conditions

Capacitance Variation

C0G (NP0): 3% or .3pF, whichever is greater

X7R: ≤ 10%

Z5U: ≤ 30%

Y5V: ≤ 30%

Q, Tan Delta

C0G (NP0): ≥ 30pF......................Q ≥ 350

≥ 10pF, < 30pF.........Q ≥ 275+5C/2

< 10pF ....................Q ≥ 200+10C

X7R: Initial requirement + .5%

Z5U: Initial requirement + 1%

Y5V: Initial requirement + 2%

Store at 85 5% relative humidity and 85°C for 1000

hours, without voltage. Remove from test chamber

and stabilize at room temperature and humidity for

48 4 hours (24 2 hours for C0G (NP0)) before

measuring.

Charge and discharge currents must be less than

50ma.

Insulation Resistance

C0G (NP0), X7R: To meet initial value x 0.3

Z5U, Y5V: ≥ Initial Value x 0.1

LOAD HUMIDITY

Specification

Charge devices with twice rated voltage in test

chamber set at +125°C 2°C for C0G (NP0) and X7R,

+85° 2°C for Z5U, and Y5V for 1000 (+48,-0) hours.

Remove from test chamber and stabilize at room

temperature for 48 4 hours (24 2 hours for C0G

(NP0)) before measuring.

Appearance

No visual defects

Capacitance Variation

C0G (NP0): 5% or .5pF, whichever is greater

X7R: ≤ 10%

Z5U: ≤ 30%

Y5V: ≤ 30%

Charge and discharge currents must be less than

50ma.

Q, Tan Delta

C0G (NP0): ≥ 30pF .....................Q ≥ 350

≥ 10pF,< 30pF.........Q ≥ 275+5C/2

< 10pF ....................Q ≥ 200+10C

X7R: Initial requirement + .5%

Z5U: Initial requirement + 1%

Y5V: Initial requirement + 2%

23

General Specifications

Mechanical

END TERMINATION ADHERENCE

BEND STRENGTH

Specification

Speed = 1mm/sec

No evidence of peeling of end terminal

2mm

Deflection

Measuring Conditions

R340mm

After soldering devices to circuit board apply 5N

(0.51kg f) for 10 1 seconds, please refer to Figure 1.

Supports

45mm

5N FORCE

Figure 2. Bend Strength

Specification

Appearance:

DEVICE UNDER TEST

Figure 1.

Terminal Adhesion

No visual defects

TEST BOARD

Capacitance Variation

C0G (NP0): 5% or .5pF, whichever is larger

X7R: ≤ 12%

RESISTANCE TO VIBRATION

Specification

Z5U: ≤ 30%

Y5V: ≤ 30%

Appearance:

No visual defects

Insulation Resistance

C0G (NP0): ≥ Initial Value x 0.3

X7R: ≥ Initial Value x 0.3

Z5U: ≥ Initial Value x 0.1

Y5V: ≥ Initial Value x 0.1

Capacitance

Within specified tolerance

Q, Tan Delta

To meet initial requirement

Measuring Conditions

Please refer to Figure 2

Insulation Resistance

C0G (NP0), X7R Ն Initial Value x 0.3

Z5U, Y5V Ն Initial Value x 0.1

Deflection:

2mm

Measuring Conditions

Test Time:

30 seconds

Vibration Frequency

10-2000 Hz

RESISTANCE TO SOLDER HEAT

Maximum Acceleration

20G

Specification

Swing Width

Appearance:

No serious defects, <25% leaching of either end

terminal

1.5mm

Test Time

X, Y, Z axis for 2 hours each, total 6 hours of test

Capacitance Variation

C0G (NP0): 2.5% or 2.5pF, whichever is greater

X7R: ≤ 7.5%

SOLDERABILITY

Specification

Z5U: ≤ 20%

Y5V: ≤ 20%

Ն 95% of each termination end should be covered with

fresh solder

Q, Tan Delta

To meet initial requirement

Measuring Conditions

Insulation Resistance

Dip device in eutectic solder at 230 5°C for

To meet initial requirement

2

.5 seconds

Dielectric Strength

No problem observed

Measuring Conditions

Dip device in eutectic solder at 260°C, for 1 minute.

Store at room temperature for 48 hours (24 hours for

C0G (NP0)) before measuring electrical parameters.

Part sizes larger than 3.20mm x 2.49mm are reheated

at 150°C for 30 5 seconds before performing test.

24

MIL-PRF-55681/Chips

Part Number Example

MILITARY DESIGNATION PER MIL-PRF-55681

Part Number Example

(example) CDR01 BP 101

B

K

S

M

L

W

D

t

MIL Style

Voltage-temperature

Limits

Capacitance

T

Rated Voltage

Capacitance Tolerance

Termination Finish

Failure Rate

MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05,

Termination Finish:

CDR06

M = Palladium Silver

N = Silver Nickel Gold

S = Solder-coated

U = Base Metallization/Barrier

Metal/Solder Coatedꢀ

W = Base Metallization/Barrier

Metal/Tinned (Tin or Tin/

Lead Alloy)

Voltage Temperature Limits:

BP = 0 30 ppm/°C without voltage; 0 30 ppm/°C with

rated voltage from -55°C to +125°C

BX = 15% without voltage; +15 –25% with rated voltage

from -55°C to +125°C

ꢀSolder shall have a melting point of 200°C or less.

Failure Rate Level: M = 1.0%, P = .1%, R = .01%,

Capacitance: Two digit figures followed by multiplier

(number of zeros to be added) e.g., 101 = 100 pF

S = .001%

Packaging: Bulk is standard packaging. Tape and reel

per RS481 is available upon request.

Rated Voltage: A = 50V, B = 100V

Capacitance Tolerance: J 5%, K 10%, M 20%

CROSS REFERENCE: AVX/MIL-PRF-55681/CDR01 THRU CDR06*

Thickness (T)

D

Termination Band (t)

Per

AVX

Length (L)

Width (W)

MIL-PRF-55681 Style

Max.

Min.

.020

Max.

—

Min.

.030

—

Max.

—

Min.

.010

CDR01

CDR02

CDR03

CDR04

0805 .080 .015 .050 .015 .055

1805 .180 .015 .050 .015 .055

1808 .180 .015 .080 .018 .080

1812 .180 .015 .125 .015 .080

—

.030

—

+.020

-.015

+.020

-.015

CDR05

1825 .180

.250

.080

.020

—

.030

.010

CDR06

2225 .225 .020 .250 .020 .080

ꢀFor CDR11, 12, 13, and 14 see AVX Microwave Chip Capacitor Catalog

25

MIL-PRF-55681/Chips

Military Part Number Identification

CDR01 thru CDR06

CDR01 thru CDR06 to MIL-PRF-55681

Military

Type

Designation

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF

tolerance

in pF

tolerance

AVX Style 0805/CDR01

AVX Style 1808/CDR03

CDR01BP100B---

CDR01BP120B---

CDR01BP150B---

CDR01BP180B---

CDR01BP220B---

10

12

15

18

22

J,K

J

J,K

J

BP

100

CDR03BP331B---

CDR03BP391B---

CDR03BP471B---

CDR03BP561B---

CDR03BP681B---

330

390

470

560

680

J,K

J

J,K

J

BP

100

J,K

CDR01BP270B---

CDR01BP330B---

CDR01BP390B---

CDR01BP470B---

CDR01BP560B---

27

33

39

47

56

J

J,K

J

J,K

J

BP

100

CDR03BP821B--

CDR03BP102B---

CDR03BX123B--

CDR03BX153B---

CDR03BX183B---

820

1000

12,000

15,000

18,000

J

J,K

K

K,M

K

BP

BX

100

CDR01BP680B---

CDR01BP820B---

CDR01BP101B---

CDR01B--121B---

CDR01B--151B---

68

82

100

120

150

J,K

J

J,K

BP

BP,BX

100

CDR03BX223B---

CDR03BX273B---

CDR03BX333B---

CDR03BX393A---

CDR03BX473A---

22,000

27,000

33,000

39,000

47,000

K,M

K

K,M

K

BX

100

50

K,M

50

CDR01B--181B---

CDR01BX221B---

CDR01BX271B---

CDR01BX331B---

CDR01BX391B---

180

220

270

330

390

J,K

K,M

K

K,M

K

BP,BX

BX

100

CDR03BX563A---

CDR03BX683A---

56,000

68,000

K

K,M

BX

50

AVX Style 1812/CDR04

CDR04BP122B---

CDR04BP152B---

CDR04BP182B---

CDR04BP222B---

CDR04BP272B---

1200

1500

1800

2200

2700

J

J,K

J

J,K

J

BP

100

CDR01BX471B---

CDR01BX561B---

CDR01BX681B---

CDR01BX821B---

CDR01BX102B---

470

560

680

820

1000

K,M

K

K,M

K

BX

100

K,M

CDR04BP332B---

CDR04BX393B---

CDR04BX473B---

CDR04BX563B---

CDR04BX823A---

3300

J,K

K

K,M

K

BP

BX

100

50

CDR01BX122B---

CDR01BX152B---

CDR01BX182B---

CDR01BX222B---

CDR01BX272B---

1200

1500

1800

2200

2700

K

K,M

K

K,M

K

BX

100

39,000

47,000

56,000

82,000

K

CDR04BX104A---

CDR04BX124A---

CDR04BX154A---

CDR04BX184A---

100,000

120,000

150,000

180,000

K,M

K

K,M

K

BX

50

CDR01BX332B---

CDR01BX392A---

CDR01BX472A---

3300

3900

4700

K,M

K

K,M

BX

100

50

AVX Style 1805/CDR02

AVX Style 1825/CDR05

CDR02BP221B---

CDR02BP271B---

CDR02BX392B---

CDR02BX472B---

CDR02BX562B---

220

270

3900

4700

5600

J,K

J

K

K,M

K

BP

BX

100

CDR05BP392B---

CDR05BP472B---

CDR05BP562B---

CDR05BX683B---

CDR05BX823B---

3900

4700

5600

68,000

82,000

J,K

K,M

K

BP

BX

100

CDR02BX682B---

CDR02BX822B---

CDR02BX103B---

CDR02BX123A---

CDR02BX153A---

6800

8200

10,000

12,000

15,000

K,M

K

K,M

K

BX

100

50

CDR05BX104B---

CDR05BX124B---

CDR05BX154B---

CDR05BX224A---

CDR05BX274A---

100,000

120,000

150,000

220,000

270,000

K,M

K

K,M

K

BX

100

50

K,M

50

CDR02BX183A---

CDR02BX223A---

18,000

22,000

K

K,M

BX

50

CDR05BX334A---

330,000

K,M

BX

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

AVX Style 2225/CDR06

CDR06BP682B---

CDR06BP822B---

CDR06BP103B---

CDR06BX394A---

CDR06BX474A---

6800

8200

10,000

390,000

470,000

J,K

K

BP

BX

100

50

K,M

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

26

MIL-PRF-55681/Chips

Military Part Number Identification

CDR31 thru CDR35

MILITARY DESIGNATION PER MIL-PRF-55681

Part Number Example

(example) CDR31 BP 101

B

K

S

M

L

W

D

t

MIL Style

Voltage-temperature

Limits

Capacitance

T

Rated Voltage

Capacitance Tolerance

Termination Finish

Failure Rate

MIL Style: CDR31, CDR32, CDR33, CDR34, CDR35

Termination Finish:

M = Palladium Silver

N = Silver Nickel Gold

S = Solder-coated

U = Base Metallization/Barrier

Metal/Solder Coatedꢀ

W = Base Metallization/Barrier

Metal/Tinned (Tin or Tin/

Lead Alloy)

Voltage Temperature Limits:

BP = 0 30 ppm/°C without voltage; 0 30 ppm/°C with

rated voltage from -55°C to +125°C

BX = 15% without voltage; +15 –25% with rated voltage

from -55°C to +125°C

ꢀSolder shall have a melting point of 200°C or less.

Capacitance: Two digit figures followed by multiplier

(number of zeros to be added) e.g., 101 = 100 pF

Failure Rate Level: M = 1.0%, P = .1%, R = .01%,

S = .001%

Rated Voltage: A = 50V, B = 100V

Packaging: Bulk is standard packaging. Tape and reel

per RS481 is available upon request.

Capacitance Tolerance: C .25 pF, D .5 pF, F 1%

J 5%, K 10%, M 20%

CROSS REFERENCE: AVX/MIL-PRF-55681/CDR31 THRU CDR35

Thickness (T)

D

Termination Band (t)

Per MIL-PRF-55681 AVX

Length (L) Width (W)

(Metric Sizes)

Style

(mm)

Max. (mm)

Min. (mm) Max. (mm) Min. (mm)

CDR31

CDR32

CDR33

CDR34

CDR35

0805

1206

1210

1812

1825

2.00

3.20

4.50

1.25

1.60

2.50

3.20

6.40

1.3

1.5

.50

—

.70

.30

27

MIL-PRF-55681/Chips

Military Part Number Identification CDR31

CDR31 to MIL-PRF-55681/7

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 0805/CDR31 (BP)

AVX Style 0805/CDR31 (BP) cont’d

CDR31BP1R0B---

CDR31BP1R1B---

CDR31BP1R2B---

CDR31BP1R3B---

CDR31BP1R5B---

1.0

1.1

1.2

1.3

1.5

C

BP

100

CDR31BP101B---

CDR31BP111B---

CDR31BP121B---

CDR31BP131B---

CDR31BP151B---

100

110

120

130

150

F,J,K

BP

100

CDR31BP1R6B---

CDR31BP1R8B---

CDR31BP2R0B---

CDR31BP2R2B---

CDR31BP2R4B---

1.6

1.8

2.0

2.2

2.4

C

BP

100

CDR31BP161B---

CDR31BP181B---

CDR31BP201B---

CDR31BP221B---

CDR31BP241B---

160

180

200

220

240

F,J,K

BP

100

CDR31BP2R7B---

CDR31BP3R0B---

CDR31BP3R3B---

CDR31BP3R6B---

CDR31BP3R9B---

2.7

3.0

3.3

3.6

3.9

C,D

BP

100

CDR31BP271B---

CDR31BP301B---

CDR31BP331B---

CDR31BP361B---

CDR31BP391B---

270

300

330

360

390

F,J,K

BP

100

CDR31BP4R3B---

CDR31BP4R7B---

CDR31BP5R1B---

CDR31BP5R6B---

CDR31BP6R2B---

4.3

4.7

5.1

5.6

6.2

C,D

BP

100

CDR31BP431B---

CDR31BP471B---

CDR31BP511A---

CDR31BP561A---

CDR31BP621A---

430

470

510

560

620

F,J,K

BP

100

50

CDR31BP6R8B---

CDR31BP7R5B---

CDR31BP8R2B---

CDR31BP9R1B---

CDR31BP100B---

6.8

7.5

8.2

9.1

10

C,D

J,K

BP

100

CDR31BP681A---

680

F,J,K

BP

50

AVX Style 0805/CDR31 (BX)

CDR31BX471B---

CDR31BX561B---

CDR31BX681B---

CDR31BX821B---

CDR31BX102B---

470

560

680

820

1,000

K,M

BX

100

CDR31BP110B---

CDR31BP120B---

CDR31BP130B---

CDR31BP150B---

CDR31BP160B---

11

12

13

15

16

J,K

BP

100

CDR31BX122B---

CDR31BX152B---

CDR31BX182B---

CDR31BX222B---

CDR31BX272B---

1,200

1,500

1,800

2,200

2,700

K,M

BX

100

CDR31BP180B---

CDR31BP200B---

CDR31BP220B---

CDR31BP240B---

CDR31BP270B---

18

20

22

24

27

J,K

F,J,K

BP

100

CDR31BX332B---

CDR31BX392B---

CDR31BX472B---

CDR31BX562A---

CDR31BX682A---

3,300

3,900

4,700

5,600

6,800

K,M

BX

100

50

CDR31BP300B---

CDR31BP330B---

CDR31BP360B---

CDR31BP390B---

CDR31BP430B---

30

33

36

39

43

F,J,K

BP

100

50

CDR31BX822A---

CDR31BX103A---

CDR31BX123A---

CDR31BX153A---

CDR31BX183A---

8,200

10,000

12,000

15,000

18,000

K,M

BX

50

CDR31BP470B---

CDR31BP510B---

CDR31BP560B---

CDR31BP620B---

CDR31BP680B---

47

51

56

62

68

F,J,K

BP

100

CDR31BP750B---

CDR31BP820B---

CDR31BP910B---

75

82

91

F,J,K

BP

100

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1/ The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

28

MIL-PRF-55681/Chips

Military Part Number Identification CDR32

CDR32 to MIL-PRF-55681/8

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 1206/CDR32 (BP)

AVX Style 1206/CDR32 (BP) cont’d

CDR32BP1R0B---

CDR32BP1R1B---

CDR32BP1R2B---

CDR32BP1R3B---

CDR32BP1R5B---

1.0

1.1

1.2

1.3

1.5

C

BP

100

CDR32BP101B---

CDR32BP111B---

CDR32BP121B---

CDR32BP131B---

CDR32BP151B---

100

110

120

130

150

F,J,K

BP

100

CDR32BP1R6B---

CDR32BP1R8B---

CDR32BP2R0B---

CDR32BP2R2B---

CDR32BP2R4B---

1.6

1.8

2.0

2.2

2.4

C

BP

100

CDR32BP161B---

CDR32BP181B---

CDR32BP201B---

CDR32BP221B---

CDR32BP241B---

160

180

200

220

240

F,J,K

BP

100

CDR32BP2R7B---

CDR32BP3R0B---

CDR32BP3R3B---

CDR32BP3R6B---

CDR32BP3R9B---

2.7

3.0

3.3

3.6

3.9

C,D

BP

100

CDR32BP271B---

CDR32BP301B---

CDR32BP331B---

CDR32BP361B---

CDR32BP391B---

270

300

330

360

390

F,J,K

BP

100

CDR32BP4R3B---

CDR32BP4R7B---

CDR32BP5R1B---

CDR32BP5R6B---

CDR32BP6R2B---

4.3

4.7

5.1

5.6

6.2

C,D

BP

100

CDR32BP431B---

CDR32BP471B---

CDR32BP511B---

CDR32BP561B---

CDR32BP621B---

430

470

510

560

620

F,J,K

BP

100

CDR32BP6R8B---

CDR32BP7R5B---

CDR32BP8R2B---

CDR32BP9R1B---

CDR32BP100B---

6.8

7.5

8.2

9.1

10

C,D

J,K

BP

100

CDR32BP681B---

CDR32BP751B---

CDR32BP821B---

CDR32BP911B---

CDR32BP102B---

680

750

820

910

1,000

F,J,K

BP

100

CDR32BP110B---

CDR32BP120B---

CDR32BP130B---

CDR32BP150B---

CDR32BP160B---

11

12

13

15

16

J,K

BP

100

CDR32BP112A---

CDR32BP122A---

CDR32BP132A---

CDR32BP152A---

CDR32BP162A---

1,100

1,200

1,300

1,500

1,600

F,J,K

BP

50

CDR32BP180B---

CDR32BP200B---

CDR32BP220B---

CDR32BP240B---

CDR32BP270B---

18

20

22

24

27

J,K

F,J,K

BP

100

CDR32BP182A---

CDR32BP202A---

CDR32BP222A---

1,800

2,000

2,200

F,J,K

BP

50

AVX Style 1206/CDR32 (BX)

CDR32BP300B---

CDR32BP330B---

CDR32BP360B---

CDR32BP390B---

CDR32BP430B---

30

33

36

39

43

F,J,K

BP

100

CDR32BX472B---

CDR32BX562B---

CDR32BX682B---

CDR32BX822B---

CDR32BX103B---

4,700

5,600

6,800

8,200

10,000

K,M

BX

100

CDR32BP470B---

CDR32BP510B---

CDR32BP560B---

CDR32BP620B---

CDR32BP680B---

47

51

56

62

68

F,J,K

BP

100

CDR32BX123B---

CDR32BX153B---

CDR32BX183A---

CDR32BX223A---

CDR32BX273A---

12,000

15,000

18,000

22,000

27,000

K,M

BX

100

50

CDR32BP750B---

CDR32BP820B---

CDR32BP910B---

75

82

91

F,J,K

BP

100

CDR32BX333A---

CDR32BX393A---

33,000

39,000

K,M

BX

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1/ The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

29

MIL-PRF-55681/Chips

Military Part Number Identification CDR33/34/35

CDR33/34/35 to MIL-PRF-55681/9/10/11

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 1210/CDR33 (BP)

AVX Style 1812/CDR34 (BX)

CDR33BP102B---

CDR33BP112B---

CDR33BP122B---

CDR33BP132B---

CDR33BP152B---

1,000

1,100

1,200

1,300

1,500

F,J,K

BP

100

CDR34BX273B---

CDR34BX333B---

CDR34BX393B---

CDR34BX473B---

CDR34BX563B---

27,000

33,000

39,000

47,000

56,000

K,M

BX

100

CDR33BP162B---

CDR33BP182B---

CDR33BP202B---

CDR33BP222B---

CDR33BP242A---

1,600

1,800

2,000

2,200

2,400

F,J,K

BP

100

50

CDR34BX104A---

CDR34BX124A---

CDR34BX154A---

CDR34BX184A---

100,000

120,000

150,000

180,000

K,M

BX

50

CDR33BP272A---

CDR33BP302A---

CDR33BP332A---

2,700

3,000

3,300

F,J,K

BP

50

AVX Style 1825/CDR35 (BP)

CDR35BP472B---

CDR35BP512B---

CDR35BP562B---

CDR35BP622B---

CDR35BP682B---

4,700

5,100

5,600

6,200

6,800

F,J,K

BP

100

AVX Style 1210/CDR33 (BX)

CDR33BX153B---

CDR33BX183B---

CDR33BX223B---

CDR33BX273B---

CDR33BX393A---

15,000

18,000

22,000

27,000

39,000

K,M

BX

100

50

CDR35BP752B---

CDR35BP822B---

CDR35BP912B---

CDR35BP103B---

CDR35BP113A---

7,500

8,200

9,100

10,000

11,000

F,J,K

BP

100

50

CDR33BX473A---

CDR33BX563A---

CDR33BX683A---

CDR33BX823A---

CDR33BX104A---

47,000

56,000

68,000

82,000

100,000

K,M

BX

50

CDR35BP123A---

CDR35BP133A---

CDR35BP153A---

CDR35BP163A---

CDR35BP183A---

12,000

13,000

15,000

16,000

18,000

F,J,K

BP

50

AVX Style 1812/CDR34 (BP)

CDR35BP203A---

CDR35BP223A---

20,000

22,000

F,J,K

BP

50

CDR34BP222B---

CDR34BP242B---

CDR34BP272B---

CDR34BP302B---

CDR34BP332B---

2,200

2,400

2,700

3,000

3,300

F,J,K

BP

100

AVX Style 1825/CDR35 (BX)

CDR35BX563B---

CDR35BX683B---

CDR35BX823B---

CDR35BX104B---

CDR35BX124B---

56,000

68,000

82,000

100,000

120,000

K,M

BX

100

CDR34BP362B---

CDR34BP392B---

CDR34BP432B---

CDR34BP472B---

CDR34BP512A---

3,600

3,900

4,300

4,700

5,100

F,J,K

BP

100

50

CDR35BX154B---

CDR35BX184A---

CDR35BX224A---

CDR35BX274A---

CDR35BX334A---

150,000

180,000

220,000

270,000

330,000

K,M

BX

100

50

CDR34BP562A---

CDR34BP622A---

CDR34BP682A---

CDR34BP752A---

CDR34BP822A---

5,600

6,200

6,800

7,500

8,200

F,J,K

BP

50

CDR35BX394A---

CDR35BX474A---

390,000

470,000

K,M

BX

50

CDR34BP912A---

CDR34BP103A---

9,100

10,000

F,J,K

BP

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1/ The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

30

European Detail Specifications

CECC 32 101-801/Chips

Standard European Ceramic Chip Capacitors

PART NUMBER (example)

0805

5

C

103

M

T

2

A

Size

(L" x W")

Voltage

50V = 5

100V = 1

200V = 2

Dielectric

1B CG = A

2R1 = C

Capacitance Capacitance Specification Terminations

Marking

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std.

Product

Code

Tolerance

See Dielectrics

C0G, X7R, Y5V

CECC32101-801 T = Plated Ni

and Sn

2F4 = G

RANGE OF APPROVED COMPONENTS

Voltage and Capacitance Range

100V

Case

Size

Dielectric

Type

50V

200V

1BCG

0603

0805

1206

1210

1808

1812

2220

1B CG

0.47pF - 150pF

0.47pF - 560pF

0.47pF - 3.3nF

0.47pF - 4.7nF

0.47pF - 6.8nF

0.47pF - 15nF

0.47pF - 39nF

0.47pF - 120pF

0.47pF - 560pF

0.47pF - 3.3nF

0.47pF - 4.7nF

0.47pF - 6.8nF

0.47pF - 15nF

0.47pF - 39nF

0.47pF - 100pF

0.47pF - 330pF

0.47pF - 1.5nF

0.47pF - 2.7nF

0.47pF - 4.7nF

0.47pF - 10nF

0.47pF - 15nF

2R1

2F4

0603

0805

1206

1210

1808

1812

2220

2R1

10pF - 6.8nF

10pF - 33nF

10pF - 100nF

10pF - 150nF

10pF - 270nF

10pF - 470nF

10pF - 1.2µF

10pF - 6.8nF

10pF - 18nF

10pF - 68nF

10pF - 100nF

10pF - 180nF

10pF - 330nF

10pF - 680nF

10pF - 1.2nF

10pF - 3.3nF

10pF - 18nF

10pF - 27nF

10pF - 47nF

10pF - 100nF

10pF - 220nF

0805

1206

1210

1808

1812

2220

2F4

10pF - 100nF

10pF - 330nF

10pF - 470nF

10pF - 560nF

10pF - 1.8µF

10pF - 2.2µF

31

Packaging of Chip Components

Automatic Insertion Packaging

TAPE & REEL QUANTITIES

All tape and reel specifications are in compliance with RS481.

8mm

12mm

Paper or Embossed Carrier

Embossed Only

0805, 1005, 1206,

1210

0504, 0907

1505, 1805,

1808

1812, 1825

2220, 2225

Paper Only

0402, 0603

2,000 or 4,000⁽¹⁾

10,000

Qty. per Reel/7" Reel

3,000

1,000

4,000

Qty. per Reel/13" Reel

10,000

⁽¹⁾Dependent on chip thickness. Low profile chips shown on page 27 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per 7" reels and are

not available on 13" reels. For 3640 size chip contact factory for quantity per reel.

REEL DIMENSIONS

Tape

A

Max.

B*

Min.

D*

Min.

N

Min.

W₂

Max.

C

W₁

W₃

Size⁽¹⁾

7.9 Min.

(.311)

8.4⁺–¹0^..⁰0

14.4

8mm

+.060

(.331

)

(.567)

10.9 Max.

(.429)

–0.0

330

(12.992)

1.5

(.059)

13.0 0.20

(.512 .008)

20.2

(.795)

50

(1.969)

11.9 Min.

(.469)

15.4 Max.

(.607)

12.4⁺–²0^..⁰0

18.4

(.724)

12mm

+.076

(.488

)

–0.0

Metric dimensions will govern.

English measurements rounded and for reference only.

(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.

32

Embossed Carrier Configuration

8 & 12mm Tape Only

8 & 12mm Embossed Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size

D₀

E

P₀

P₂

T Max.

T₁

G₁

G₂

8mm

and

12mm

8.4⁺-0⁰.^.0¹⁰

1.75 0.10

4.0 0.10

2.0 0.05

0.600

(.024)

0.10

(.004)

Max.

0.75

+.004

(.059

-0.0

)

(.069 .004) (.157 .004) (.079 .002)

(.030)

Min.

See Note 3

See Note 4

VARIABLE DIMENSIONS

Tape Size

B₁

D₁

F

P₁

R

T₂

W

A₀B₀K₀

Max.

Min.

See Note 6 See Note 5

See Note 2

8.0⁺-0⁰.^.1³

4.55

1.0

3.5 0.05

4.0 0.10

25

2.5 Max

(.098)

8mm

See Note 1

(.315⁺-.^.0⁰0¹4²

)

(.179)

(.039)

(.138 .002) (.157 .004)

(.984)

8.2

(.323)

1.5

(.059)

5.5 0.05

(.217 .002) (.157 .004)

4.0 0.10

30

(1.181)

6.5 Max.

(.256)

12.0 .30

(.472 .012)

12mm

8.0⁺^-0⁰^.^.¹³

8mm

1/2 Pitch

4.55

(.179)

1.0

(.039)

3.5 0.05

(.138 .002) 0.79 .004

2.0 0.10

25

(.984)

2.5 Max.

(.098)

(.315⁺-.^.0⁰0¹4²

)

12mm

Double

Pitch

8.2

(.323)

1.5

(.059)

5.5 0.05

(.217 .002) (.315 .004)

8.0 0.10

30

(1.181)

6.5 Max.

(.256)

12.0 .30

(.472 .012)

NOTES:

1. A₀, B₀, and K₀are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The

clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A₀, B₀, and K₀) must be within 0.05 mm (.002) min. and 0.50 mm

(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches C & D).

2. Tape with components shall pass around radius “R” without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12 mm

embossed tape for reels with hub diameters approaching N min. (Table 4).

3. G₁dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the

cavity whichever is less.

4. G₂dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity

or to the edge of the cavity whichever is less.

5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment.

Dimensions of embossment location and hole location shall be applied independent of each other.

6. B₁dimension is a reference dimension for tape feeder clearance only.

33

Paper Carrier Configuration

8 & 12mm Tape Only

8 & 12mm Paper Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size

D₀

E

P₀

P₂

T₁

G₁

G₂

R MIN.

+0.1

8mm

and

12mm

1.5 ^-0.0

1.75 0.10

4.0 0.10

2.0 0.05

0.10

(.004)

Max.

0.75

(.030)

Min.

0.75

(.030)

Min.

25 (.984)

See Note 2

+.004

-.000

(.059

)

(.069 .004) (.157 .004) (.079 .002)

VARIABLE DIMENSIONS

Tape Size

P₁

F

W

A₀B₀

See Note 1

T

8.0⁺^-0⁰^.^.¹³

8mm

4.0 0.10

(.157 .004)

3.5 0.05

(.138 .002)

See Note 3

(.315⁺-.^.0⁰0¹4²

)

4.0 .010

(.157 .004)

5.5 0.05

(.217 .002)

12.0 0.3

(.472 .012)

12mm

8.0⁺-0⁰.^.1³

8mm

1/2 Pitch

2.0 0.10

(.079 .004)

3.5 0.05

(.138 .002)

(.315⁺-.^.0⁰0¹4²

)

12mm

Double

Pitch

8.0 0.10

(.315 .004)

5.5 0.05

(.217 .002)

12.0 0.3

(.472 .012)

NOTES:

1. A₀, B₀, and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The

clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A₀, B₀, and T) must be within 0.05 mm (.002) min. and 0.50 mm

(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A & B).

2. Tape with components shall pass around radius “R” without damage.

3. 1.1 mm (.043) Base Tape and 1.6 mm (.063) Max. for Non-Paper Base Compositions.

Bar Code Labeling Standard

AVX bar code labeling is available and follows latest version of EIA-556-A.

34

Bulk Case Packaging

BENEFITS

BULK FEEDER

• Easier handling

• Smaller packaging volume

(1/20 of T/R packaging)

• Easier inventory control

• Flexibility

Case

Cassette

• Recyclable

Gate

Shooter

CASE DIMENSIONS

Shutter

Slider

12mm

36mm

Mounter

Head

Expanded Drawing

110mm

Chips

Attachment Base

CASE QUANTITIES

Part Size

0402

0603

0805

Qty.

(pcs / cassette)

10,000 (T=0.6mm)

5,000 (T¯≥0.6mm)

80,000

15,000

35

General Description

Basic Construction – A multilayer ceramic (MLC) capaci-

tor is a monolithic block of ceramic containing two sets of

offset, interleaved planar electrodes that extend to two

opposite surfaces of the ceramic dielectric. This simple

structure requires a considerable amount of sophistication,

both in material and manufacture, to produce it in the quality

and quantities needed in today’s electronic equipment.

Electrode

Ceramic Layer

End Terminations

Terminated

Edge

Terminated

Edge

Margin

Electrodes

Formulations – Multilayer ceramic capacitors are available

in both Class 1 and Class 2 formulations. Temperature

compensating formulation are Class 1 and temperature

stable and general application formulations are classified

as Class 2.

Class 2 – EIA Class 2 capacitors typically are based on the

chemistry of barium titanate and provide a wide range of

capacitance values and temperature stability. The most

commonly used Class 2 dielectrics are X7R and Y5V. The

X7R provides intermediate capacitance values which vary

only 15% over the temperature range of -55°C to 125°C. It

finds applications where stability over a wide temperature

range is required.

Class 1 – Class 1 capacitors or temperature compensating

capacitors are usually made from mixtures of titanates

where barium titanate is normally not a major part of the

mix. They have predictable temperature coefficients and

in general, do not have an aging characteristic. Thus they

are the most stable capacitor available. The most popular

Class 1 multilayer ceramic capacitors are C0G (NP0)

temperature compensating capacitors (negative-positive

0 ppm/°C).

The Y5V provides the highest capacitance values and is

used in applications where limited temperature changes are

expected. The capacitance value for Y5V can vary from

22% to -82% over the -30°C to 85°C temperature range.

The Z5U dielectric is between X7R and Y5V in both stability

and capacitance range.

All Class 2 capacitors vary in capacitance value under the

influence of temperature, operating voltage (both AC and

DC), and frequency. For additional information on perfor-

mance changes with operating conditions, consult AVX’s

software, SpiCap.

36

General Description

Effects of Voltage – Variations in voltage have little effect

on Class 1 dielectric but does affect the capacitance and

dissipation factor of Class 2 dielectrics. The application of

DC voltage reduces both the capacitance and dissipation

factor while the application of an AC voltage within a

reasonable range tends to increase both capacitance and

dissipation factor readings. If a high enough AC voltage is

applied, eventually it will reduce capacitance just as a DC

voltage will. Figure 2 shows the effects of AC voltage.

Cap. Change vs. D.C. Volts

AVX X7R T.C.

2.5

0

-2.5

-5

-7.5

-10

Cap. Change vs. A.C. Volts

AVX X7R T.C.

25%

50%

Percent Rated Volts

Figure 4

75%

100%

50

40

30

20

Typical Cap. Change vs. Temperature

AVX X7R T.C.

+20

+10

0

10

0

0VDC

RVDC

12.5

25

37.5

50

Volts AC at 1.0 KHz

Figure 2

-10

Capacitor specifications specify the AC voltage at which to

measure (normally 0.5 or 1 VAC) and application of the

wrong voltage can cause spurious readings. Figure 3 gives

the voltage coefficient of dissipation factor for various AC

voltages at 1 kilohertz. Applications of different frequencies

will affect the percentage changes versus voltages.

-20

-30

-55 -35 -15 +5 +25 +45 +65 +85 +105 +125

Temperature Degrees Centigrade

Figure 5

D.F. vs. A.C. Measurement Volts

AVX X7R T.C.

Effects of Time – Class 2 ceramic capacitors change

capacitance and dissipation factor with time as well as tem-

perature, voltage and frequency. This change with time is

known as aging. Aging is caused by a gradual re-alignment

of the crystalline structure of the ceramic and produces an

exponential loss in capacitance and decrease in dissipation

factor versus time. A typical curve of aging rate for semi-

stable ceramics is shown in Figure 6.

10.0

Curve 1 - 100 VDC Rated Capacitor

Curve 2 - 50 VDC Rated Capacitor

Curve 3 - 25 VDC Rated Capacitor

Curve 3

Curve 2

8.0

6.0

4.0

If a Class 2 ceramic capacitor that has been sitting on the

shelf for a period of time, is heated above its curie point,

Curve 1

2.0

0

1

(125°C for 4 hours or 150°C for ⁄

2

hour will suffice) the part

will de-age and return to its initial capacitance and dissi-

pation factor readings. Because the capacitance changes

rapidly, immediately after de-aging, the basic capacitance

measurements are normally referred to a time period some-

time after the de-aging process. Various manufacturers use

different time bases but the most popular one is one day

or twenty-four hours after “last heat.” Change in the aging

curve can be caused by the application of voltage and

other stresses. The possible changes in capacitance due to

de-aging by heating the unit explain why capacitance

changes are allowed after test, such as temperature cycling,

moisture resistance, etc., in MIL specs. The application of

high voltages such as dielectric withstanding voltages also

.5

1.0

1.5

2.0

2.5

AC Measurement Volts at 1.0 KHz

Figure 3

The effect of the application of DC voltage is shown in

Figure 4. The voltage coefficient is more pronounced for

higher K dielectrics. These figures are shown for room tem-

perature conditions. The combination characteristic known

as voltage temperature limits which shows the effects of

rated voltage over the operating temperature range is

shown in Figure 5 for the military BX characteristic.

37

General Description

tends to de-age capacitors and is why re-reading of capac-

itance after 12 or 24 hours is allowed in military specifica-

tions after dielectric strength tests have been performed.

Effects of Mechanical Stress – High “K” dielectric

ceramic capacitors exhibit some low level piezoelectric

reactions under mechanical stress. As a general statement,

the piezoelectric output is higher, the higher the dielectric

constant of the ceramic. It is desirable to investigate this

effect before using high “K” dielectrics as coupling capaci-

tors in extremely low level applications.

Typical Curve of Aging Rate

X7R Dielectric

+1.5

0

Reliability – Historically ceramic capacitors have been one

of the most reliable types of capacitors in use today.

The approximate formula for the reliability of a ceramic

capacitor is:

-1.5

L_o

L_t

V_t

X

T_t

Y

=

͑ ͑

V

T

o

-3.0

-4.5

where

L_o= operating life

L_t= test life

V_t= test voltage

T_t= test temperature and

T_o= operating temperature

in °C

V_o= operating voltage

X,Y = see text

-6.0

-7.5

Historically for ceramic capacitors exponent X has been

considered as 3. The exponent Y for temperature effects

typically tends to run about 8.

1

10

100 1000 10,000 100,000

Hours

Characteristic Max. Aging Rate %/Decade

None

C0G (NP0)

X7R

Z5U

A capacitor is a component which is capable of storing

electrical energy. It consists of two conductive plates (elec-

trodes) separated by insulating material which is called the

dielectric. A typical formula for determining capacitance is:

2

3

5

Y5V

Figure 6

.224 KA

Effects of Frequency – Frequency affects capacitance

and impedance characteristics of capacitors. This effect is

much more pronounced in high dielectric constant ceramic

formulation that is low K formulations. AVX’s SpiCap soft-

ware generates impedance, ESR, series inductance, series

resonant frequency and capacitance all as functions of fre-

quency, temperature and DC bias for standard chip sizes

and styles. It is available free from AVX.

C =

t

C = capacitance (picofarads)

K = dielectric constant (Vacuum = 1)

A = area in square inches

t = separation between the plates in inches

(thickness of dielectric)

.224 = conversion constant

(.0884 for metric system in cm)

Capacitance – The standard unit of capacitance is the

farad. A capacitor has a capacitance of 1 farad when 1

coulomb charges it to 1 volt. One farad is a very large unit

-6

and most capacitors have values in the micro (10 ), nano

-9

-12

(10 ) or pico (10 ) farad level.

Dielectric Constant – In the formula for capacitance given

above the dielectric constant of a vacuum is arbitrarily cho-

sen as the number 1. Dielectric constants of other materials

are then compared to the dielectric constant of a vacuum.

Dielectric Thickness – Capacitance is indirectly propor-

tional to the separation between electrodes. Lower voltage

requirements mean thinner dielectrics and greater capaci-

tance per volume.

Area – Capacitance is directly proportional to the area of

the electrodes. Since the other variables in the equation are

usually set by the performance desired, area is the easiest

parameter to modify to obtain a specific capacitance within

a material group.

38

General Description

Energy Stored – The energy which can be stored in a

capacitor is given by the formula:

I (Ideal)

I (Actual)

E = ¹⁄ CV²

2

Loss

Angle

Phase

Angle

E = energy in joules (watts-sec)

V = applied voltage

␦

C = capacitance in farads

f

Potential Change – A capacitor is a reactive component

which reacts against a change in potential across it. This is

shown by the equation for the linear charge of a capacitor:

V

IR_s

dV

dt

In practice the current leads the voltage by some other

phase angle due to the series resistance R_S. The comple-

ment of this angle is called the loss angle and:

I_ideal

=

C

where

I = Current

C = Capacitance

dV/dt = Slope of voltage transition across capacitor

^{Power Factor (P.F.) = Cos}f ^{or Sine ␦}

Dissipation Factor (D.F.) = tan ␦

Thus an infinite current would be required to instantly

change the potential across a capacitor. The amount of

current a capacitor can “sink” is determined by the above

equation.

for small values of ␦ the tan and sine are essentially equal

which has led to the common interchangeability of the two

terms in the industry.

Equivalent Circuit – A capacitor, as a practical device,

exhibits not only capacitance but also resistance and induc-

tance. A simplified schematic for the equivalent circuit is:

Equivalent Series Resistance – The term E.S.R. or

Equivalent Series Resistance combines all losses both

series and parallel in a capacitor at a given frequency so

that the equivalent circuit is reduced to a simple R-C series

connection.

C = Capacitance

L = Inductance

R_p= Parallel Resistance

R_s= Series Resistance

R _P

E.S.R.

C

L

R _S

Dissipation Factor – The DF/PF of a capacitor tells what

percent of the apparent power input will turn to heat in the

capacitor.

C

Reactance – Since the insulation resistance (R_p) is normally

very high, the total impedance of a capacitor is:

E.S.R.

Dissipation Factor =

= (2 π fC) (E.S.R.)

X_C

The watts loss are:

2

Z = R_S+ (X_C- X_L)

ͱ

Watts loss = (2 π fCV²) (D.F.)

where

Z = Total Impedance

R_s= Series Resistance

X_C= Capacitive Reactance =

Very low values of dissipation factor are expressed as their

reciprocal for convenience. These are called the “Q” or

Quality factor of capacitors.

1

2 π fC

Parasitic Inductance – The parasitic inductance of capac-

itors is becoming more and more important in the decou-

pling of today’s high speed digital systems. The relationship

between the inductance and the ripple voltage induced on

the DC voltage line can be seen from the simple inductance

equation:

X_L= Inductive Reactance = 2 π fL

The variation of a capacitor’s impedance with frequency

determines its effectiveness in many applications.

Phase Angle – Power Factor and Dissipation Factor are

often confused since they are both measures of the loss in a

capacitor under AC application and are often almost identi-

cal in value. In a “perfect” capacitor the current in the

capacitor will lead the voltage by 90°.

di

dt

V = L

39

General Description

di

dt

is determined by dividing the rated voltage by IR (Ohm’s

Law).

The

seen in current microprocessors can be as high as

0.3 A/ns, and up to 10A/ns. At 0.3 A/ns, 100pH of parasitic

inductance can cause a voltage spike of 30mV. While this

does not sound very drastic, with the Vcc for microproces-

sors decreasing at the current rate, this can be a fairly large

percentage.

Dielectric Strength – Dielectric Strength is an expression

of the ability of a material to withstand an electrical stress.

Although dielectric strength is ordinarily expressed in volts, it

is actually dependent on the thickness of the dielectric and

thus is also more generically a function of volts/mil.

Another important, often overlooked, reason for knowing

the parasitic inductance is the calculation of the resonant

frequency. This can be important for high frequency, by-

pass capacitors, as the resonant point will give the most

signal attenuation. The resonant frequency is calculated

from the simple equation:

Dielectric Absorption – A capacitor does not discharge

instantaneously upon application of a short circuit, but

drains gradually after the capacitance proper has been dis-

charged. It is common practice to measure the dielectric

absorption by determining the “reappearing voltage” which

appears across a capacitor at some point in time after it has

been fully discharged under short circuit conditions.

f^res=

1

ͱ

2␲ LC

Corona – Corona is the ionization of air or other vapors

which causes them to conduct current. It is especially

prevalent in high voltage units but can occur with low voltages

as well where high voltage gradients occur. The energy

discharged degrades the performance of the capacitor and

can in time cause catastrophic failures.

Insulation Resistance – Insulation Resistance is the resis-

tance measured across the terminals of a capacitor and

consists principally of the parallel resistance R^Pshown in

the equivalent circuit. As capacitance values and hence the

area of dielectric increases, the I.R. decreases and hence

the product (C x IR or RC) is often specified in ohm farads

or more commonly megohm-microfarads. Leakage current

40

Surface Mounting Guide

MLC Chip Capacitors

Component Pad Design

Component pads should be designed to achieve good sol-

der filets and minimize component movement during reflow

soldering. Pad designs are given below for the most com-

mon sizes of multilayer ceramic capacitors for both wave

and reflow soldering. The basis of these designs is:

• Pad width equal to component width. It is permissible to

decrease this to as low as 85% of component width but it

is not advisable to go below this.

• Pad overlap 0.5mm beneath component.

• Pad extension 0.5mm beyond components for reflow and

1.0mm for wave soldering.

REFLOW SOLDERING

Case Size

0402

D1

D2

D3

D4

D5

D2

1.70 (0.07)

2.30 (0.09)

3.00 (0.12)

4.00 (0.16)

5.60 (0.22)

6.60 (0.26)

0.60 (0.02)

0.80 (0.03)

1.00 (0.04)

1.00 (0.04))

1.00 (0.04)

0.50 (0.02)

0.70 (0.03)

1.00 (0.04)

2.00 (0.09)

3.60 (0.14)

4.60 (0.18)

0.60 (0.02)

0.80 (0.03)

1.00 (0.04)

0.50 (0.02)

0.75 (0.03)

1.25 (0.05)

1.60 (0.06)

2.50 (0.10)

2.00 (0.08)

3.00 (0.12)

6.35 (0.25)

5.00 (0.20)

6.35 (0.25)

0603

0805

1206

1210

1808

1812

1825

2220

D1

D3

D4

D5

2225

Dimensions in millimeters (inches)

41

Surface Mounting Guide

MLC Chip Capacitors

WAVE SOLDERING

D2

Case Size

0603

D1

D2

D3

D4

D5

3.10 (0.12)

4.00 (0.15)

5.00 (0.19)

1.20 (0.05)

1.50 (0.06)

0.70 (0.03)

1.00 (0.04)

2.00 (0.09)

1.20 (0.05)

1.50 (0.06)

0.75 (0.03)

1.25 (0.05)

1.60 (0.06)

2.50 (0.10)

D1

D3

D4

0805

1206

1210

D5

Dimensions in millimeters (inches)

Component Spacing

Preheat & Soldering

For wave soldering components, must be spaced sufficiently

far apart to avoid bridging or shadowing (inability of solder

to penetrate properly into small spaces). This is less impor-

tant for reflow soldering but sufficient space must be

allowed to enable rework should it be required.

The rate of preheat should not exceed 4°C/second to

prevent thermal shock. A better maximum figure is about

2°C/second.

For capacitors size 1206 and below, with a maximum

thickness of 1.25mm, it is generally permissible to allow a

temperature differential from preheat to soldering of 150°C.

In all other cases this differential should not exceed 100°C.

For further specific application or process advice, please

consult AVX.

≥1.5mm (0.06)

≥1mm (0.04)

Cleaning

Care should be taken to ensure that the capacitors are

thoroughly cleaned of flux residues especially the space

beneath the capacitor. Such residues may otherwise

become conductive and effectively offer a low resistance

bypass to the capacitor.

≥1mm (0.04)

Ultrasonic cleaning is permissible, the recommended

conditions being 8 Watts/litre at 20-45 kHz, with a process

cycle of 2 minutes vapor rinse, 2 minutes immersion in the

ultrasonic solvent bath and finally 2 minutes vapor rinse.

42

Surface Mounting Guide

MLC Chip Capacitors

General

APPLICATION NOTES

Surface mounting chip multilayer ceramic capacitors

are designed for soldering to printed circuit boards or other

substrates. The construction of the components is such that

they will withstand the time/temperature profiles used in both

wave and reflow soldering methods.

Storage

Good solderability is maintained for at least twelve months,

provided the components are stored in their “as received”

packaging at less than 40°C and 70% RH.

Solderability

Handling

Terminations to be well soldered after immersion in a 60/40

tin/lead solder bath at 235 5°C for 2 1 seconds.

Chip multilayer ceramic capacitors should be handled with

care to avoid damage or contamination from perspiration

and skin oils. The use of tweezers or vacuum pick ups

is strongly recommended for individual components. Bulk

handling should ensure that abrasion and mechanical shock

are minimized. Taped and reeled components provides the

ideal medium for direct presentation to the placement

machine. Any mechanical shock should be minimized during

handling chip multilayer ceramic capacitors.

Leaching

Terminations will resist leaching for at least the immersion

times and conditions shown below.

Solder

Tin/Lead/Silver Temp. °C

60/40/0 260 5

Solder

Immersion Time

Seconds

Termination Type

Nickel Barrier

30 1

Preheat

It is important to avoid the possibility of thermal shock during

soldering and carefully controlled preheat is therefore

required. The rate of preheat should not exceed 4°C/second

and a target figure 2°C/second is recommended. Although

an 80°C to 120°C temperature differential is preferred,

recent developments allow a temperature differential

between the component surface and the soldering temper-

ature of 150°C (Maximum) for capacitors of 1210 size and

below with a maximum thickness of 1.25mm. The user is

cautioned that the risk of thermal shock increases as chip

size or temperature differential increases.

Recommended Soldering Profiles

Reflow

300

Natural

Cooling

Preheat

250

200

220°C

150

100

50

to

250°C

Soldering

Mildly activated rosin fluxes are preferred. The minimum

amount of solder to give a good joint should be used.

Excessive solder can lead to damage from the stresses

caused by the difference in coefficients of expansion

between solder, chip and substrate. AVX terminations are

suitable for all wave and reflow soldering systems. If hand

soldering cannot be avoided, the preferred technique is the

utilization of hot air soldering tools.

0

1min

(Minimize soldering time)

10 sec. max

1min

Wave

Cooling

Natural cooling in air is preferred, as this minimizes stresses

within the soldered joint. When forced air cooling is used,

cooling rate should not exceed 4°C/second. Quenching

is not recommended but if used, maximum temperature

differentials should be observed according to the preheat

conditions above.

300

Preheat

Natural

Cooling

250

200

150

100

50

T

230°C

to

Cleaning

250°C

Flux residues may be hygroscopic or acidic and must be

removed. AVX MLC capacitors are acceptable for use with

all of the solvents described in the specifications MIL-STD-

202 and EIA-RS-198. Alcohol based solvents are acceptable

and properly controlled water cleaning systems are also

acceptable. Many other solvents have been proven successful,

and most solvents that are acceptable to other components

on circuit assemblies are equally acceptable for use with

ceramic capacitors.

0

1 to 2 min

3 sec. max

(Preheat chips before soldering)

T/maximum 150°C

43

Internet/FAX/CD Rom/Software

Need Additional Information on AVX Products

Internet –

For more information visit us on the worldwide web at

http://www.avxcorp.com

FAX Back Service –

Just dial 1-800-879-1613 and request the index for additional

catalog information faxed to your FAX number.

CD ROM –

Or get in touch with your AVX representative for a CD Rom or copies

of the catalogs and technical papers.

Software –

Comprehensive capacitor application software library which includes:

SpiCap (for MLC chip capacitors)

SpiTan (for tantalum capacitors)

SpiCalci (for power supply capacitors)

SpiMic (for RF-Microwave capacitors)

For AVX/Elco connector information contact your local

AVX/Elco representative

NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All

statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or

responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without

representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user

should not assume that all safety measures are indicated or that other measures may not be required. Specifications are typical and may

not apply to all applications.

44

USA

EUROPE

ASIA-PACIFIC

AVX Myrtle Beach, SC

Corporate Offices

AVX Limited, England

European Headquarters

AVX/Kyocera, Singapore

Asia-Pacific Headquarters

Tel: 843-448-9411

FAX: 843-448-1943

Tel: ++44 (0)1252 770000

FAX: ++44 (0)1252 770001

Tel: (65) 258-2833

FAX: (65) 350-4880

AVX Northwest, WA

AVX S.A., France

AVX/Kyocera, Hong Kong

Tel: 360-669-8746

FAX: 360-699-8751

Tel: ++33 (1) 69.18.46.00

FAX: ++33 (1) 69.28.73.87

Tel: (852) 2-363-3303

FAX: (852) 2-765-8185

AVX North Central, IN

AVX GmbH, Germany - AVX

AVX/Kyocera, Korea

Tel: 317-848-7153

FAX: 317-844-9314

Tel: ++49 (0) 8131 9004-0

FAX: ++49 (0) 8131 9004-44

Tel: (82) 2-785-6504

FAX: (82) 2-784-5411

AVX Northeast, MA

AVX GmbH, Germany - Elco

AVX/Kyocera, Taiwan

Tel: 508-485-8114

FAX: 508-485-8471

Tel: ++49 (0) 2741 2990

FAX: ++49 (0) 2741 299133

Tel: (886) 2-2516-7010

FAX: (886) 2-2506-9774

AVX Mid-Pacific, CA

AVX srl, Italy

AVX/Kyocera, China

Tel: 408-436-5400

FAX: 408-437-1500

Tel: ++390 (0)2 614571

FAX: ++390 (0)2 614 2576

Tel: (86) 21-6249-0314-16

FAX: (86) 21-6249-0313

AVX Southwest, AZ

AVX sro, Czech Republic

AVX/Kyocera, Malaysia

Tel: 602-539-1496

FAX: 602-539-1501

Tel: ++420 (0)467 558340

FAX: ++420 (0)467 2844

Tel: (60) 4-228-1190

FAX: (60) 4-228-1196

Elco, Japan

AVX South Central, TX

Tel: 045-943-2906/7

FAX: 045-943-2910

Tel: 972-669-1223

FAX: 972-669-2090

Kyocera, Japan

Tel: (81) 75-593-4518

FAX: (81) 75-502-2705

AVX Southeast, NC

Tel: 919-878-6357

FAX: 919-878-6462

Contact:

AVX Canada

Tel: 905-564-8959

FAX: 905-564-9728

A KYOCERA GROUP COMPANY

http://www.avxcorp.com

S-MCC20M299-C


型号：	08053C100FAT4A
厂家：	KYOCERA AVX
描述：	Multilayer Ceramic Chip Capacitor 多层瓷介片状电容器电容器
文件：	总46页 (文件大小：399K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

08053C100FAT4A [KYOCERA AVX]

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